open menu

Structural Analysis, CAE & Analytical Methods

Structural Analysis

FEA Modal & Dynamic Response Analysis

FEA Modal & Dynamic Response Analysis

FEA is used during the design process to assess the strength and stiffness, response of the structure to various shock and vibration environments including:  
  • Statics Analysis
  • Vibrations including harmonic, random, sine-on-random, transient
  • Shock including operational, crash safety, shipping

Structural Substantiation

Comprehensive analysis to ensure qualification and certification requirements such as: RTCA/DO-160, MIL-STD-810  

Thermal Analysis and Heat Transfer

FEA and analytical models developed for various electronic enclosures and gimbals, from critical components to the overall system. Steady state and transient analysis determine the effectiveness of dissipating heat while accounting for: ambient temperature, altitude, Sun exposure, location on the aircraft, mounting type, air flow, presence of heat exchangers.  
Thermal modeling altitude - steady state

Thermal modeling altitude – steady state

Thermal Modeling - Transient

Thermal Modeling – Transient

Analytical Models, Closed Form Solutions and Algorithms

Various analytical models have been developed to support feasibility studies and conceptual design for effective assessment. The models are also used to verify FEA, boundary conditions and results.  
  • Response analysis of Passive Isolation Systems and Structures to shocks and vibrations including harmonic and sine-on-random combinations
  • Fatigue Analysis including response to random vibration and probability distribution
  • Thermal modelling
  • Electro-magnetic forces for Linear Torque Motors
  • Solid mechanics
  • System kinematics and dynamics
Isolator Response - Sine-on-Random

Isolator Response – Sine-on-Random

Fatigue Analysis

Fatigue Analysis

Shaker Table Simulation

Shaker Table Simulation


20/20 Engineering strives to provide customers with the best solutions in a timely manner. FEA and Analytical modelling are used during the design process to meet and improve critical characteristics of the system.  

  • Weight and strength
  • Resonant frequencies
  • Response to shock and vibrations
  • Stability performance, LOS jitter reduction
  • Thermal characteristics